SIMS and XPS Analysis of Interfaces in Passivation Layers on C-Silicon Under Low-Energy Electron Radiation
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Graphical Abstract
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Abstract
In order to investigate chemical structure change in surface passivation layers of C-silicon material under radiation of low-energy electrons, three kinds of surface passivation C-silicon material are prepared, which are mono-SiO2 layer, SiO2/Si3N4 compound layers and boronsilicate glass/Si3N4 compound layers. They are radiated under electrons of Emax=70 keV from electron accelerator for 6 hours in air atmosphere. Depth changes of Si, N, B before and after electron radiation are measured by secondary ion mass spectroscopy(SIMS) and argon ion etching X-ray photoelectron spectroscopy(XPS). The results show that changes at interfaces of SiO2/Si are remarkable both in mono-SiO2 passivation samples and Si3N4/SiO2 passivation samples. The possible reason is stoichiometric proportion of SiO2 at the interface is changed to SiOx(x<2) under irradiation because of Si-O bond breaking. In case of Si3N4/SiO2/Si passivation sample, the dissociated oxygen results from Si-O bond breaking might drift through SiO2 to SiO2/Si3N4 interface. In case of Si3N4/boronsilicate glass/Si sample, chemical structure changes in interfaces of boronsilicate glass/Si3N4 and boronsilicate glass/Si are less remarkable than those both of SiO2/Si and Si3N4/SiO2/Si samples. It indicates that the radiation damage of surface passivation layers of C-silicon material from low-energy electrons mainly takes place at interface of SiO2/Si, which can not be noticeably improved by SiO2/Si3N4 combined passivation. While using boronsilicate glass/Si3N4 combined passivation can help to keep chemical structure stable at interfaces between surface passivation layers of C-silicon material under radiation of low-energy electrons in air atmosphere.
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